Lenovo is preparing to release its first gaming smartphone under the Legion brand. The device is equipped with the Snapdragon 865 chipset and, according to insiders, is gaining 600,000 points in the AnTuTu benchmark.
And now there is new information voiced by Chen Jin from Lenovo China Mobile. He announced the new cooling system that the device will receive. Although there are no technical details yet, it is possible that this will be a system based on heat pipes with an additional active cooler. Although Gene claims that the new product will be different from everything on the market, and will surpass the decisions of competitors. If these are not simple marketing promises, then the new Lenovo Legion can get some very interesting solutions. After all, the company has solid experience in the field of gaming PCs, which can be applied to mobile gaming systems. Note that there is still no deadline for a new smartphone to enter the market.